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IRF9620 Datasheet, PDF (3/7 Pages) Intersil Corporation – 3.5A, 200V, 1.500 Ohm, P-Channel Power MOSFET
IRF9620
Source to Drain Diode Specifications
PARAMETER
Continuous Source to Drain Current
Pulse Source to Drain Current
(Note 3)
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
ISD
ISDM
Modified MOSFET Sym-
bol Showing the Integral
Reverse
P-N Junction Diode
G
-
-
-3.5
A
D
-
-
-14
A
S
Source to Drain Diode Voltage (Note 2)
Reverse Recovery Time
Reverse Recovery Charge
VSD
TC = 25oC, ISD = -3.5A, VGS = 0V (Figure 13)
-
trr
TJ = 150oC, ISD = -3.5A, dISD/dt = 100A/µs
-
QRR
TJ = 150oC, ISD = -3.5A, dISD/dt = 100A/µs
-
-
-1.5
V
300
-
ns
1.9
-
µC
NOTES:
2. Pulse test: pulse width ≤ 300µs, duty cycle ≤ 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3).
4. VDD = 50V, starting TJ = 25oC, L = 35.5mH, RG = 25Ω, peak IAS = 3.5A (Figures 15, 16).
Typical Performance Curves Unless Otherwise Specified
1.2
1.0
0.8
0.6
0.4
0.2
0
0
50
100
150
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
-5
-4
-3
-2
-1
0
25
50
75
100
125
150
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
SINGLE PULSE
0.01
10-5
10-4
PDM
NOTES:
t1
t2
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
10-3
10-2
10-1
1
10
t1, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
4-23