ICM7211AM_06 Datasheet, PDF (3/8 Pages) Intersil Corporation – 4-Digit, LCD Display Driver

ICM7211AM
Absolute Maximum Ratings
Supply Voltage (V_DD - V_SS) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
Input Voltage (Any Terminal) (Note 1) . . . V_SS - 0.3V to V_DD, + 0.3V
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Information
Thermal Resistance (Typical, Note 2)
θ_JA (°C/W)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
60
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
70
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . .-65×°C to 150°C
Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . . 300°C
*Pb-free PDIPs can be used for through hole wave solder process-
ing only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Due to the SCR structure inherent in the CMOS process, connecting any terminal to voltages greater than V_DD or less than V_SS may cause
destructive device latchup. For this reason, it is recommended that no inputs from external sources not operating on the same power supply be
applied to the device before its supply is established, and that in multiple supply systems, the supply to the ICM7211AM be turned on first.
2. θ_JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
CHARACTERISTICS V_DD = 5V ±10%, T_A = 25°C, V_SS = 0V Unless Otherwise Specified
Operating Supply Voltage Range (V_DD - V_SS), V_SUPPLY
Operating Current, I_DD
Test circuit, Display blank
Oscillator Input Current, I_OSCI
Pin 36
Segment Rise/Fall Time, t_r, t_f
C_L = 200pF
Backplane Rise/Fall Time, t_r, t_f
C_L = 5000pF
Oscillator Frequency, f_OSC
Pin 36 Floating
Backplane Frequency, f_BP
Pin 36 Floating
INPUT CHARACTERISTICS
3
5
6
V
-
10
50
µA
-
±2
±10
µA
-
0.5
-
µs
-
1.5
-
µs
-
19
-
kHz
-
150
-
Hz
Logical “1” Input Voltage, V_IH
Logical “0” Input Voltage, V_IL
Input Leakage Current, I_ILK
Input Capacitance, C_lN
BP/Brightness Input Leakage, I_BPLK
BP/Brightness Input Capacitance, C_BPI
AC CHARACTERISTICS
4
-
-
V
-
-
1
V
Pins 27-34
-
±0.01
±1
µA
Pins 27-34
-
5
-
pF
Measured at Pin 5 with Pin 36 at V_SS
-
±0.01
±1
µA
All Devices
-
200
-
pF
Chip Select Active Pulse Width, t_WL
Other Chip Select Either Held Active, or 200
-
Both Driven Together
-
ns
Data Setup Time, t_DS
Data Hold Time, t_DH
Inter-Chip Select Time, t_ICS
100
-
10
0
2
-
-
ns
-
ns
-
µs
3
FN3158.7
April 17, 2006