English
Language : 

CD4015BT Datasheet, PDF (3/3 Pages) Intersil Corporation – CMOS Dual 4-Stage Static Shift Register With Serial Input/Parallel Output
CD4015BT
Die Characteristics
DIE DIMENSIONS:
(2032µm x 2489µm x 533µm ±25.4µm)
80 x 98 x 21mils ±1mil
METALLIZATION:
Type: Al
Thickness: 12.5kÅ ±1.5kÅ
SUBSTRATE POTENTIAL:
Leave Floating or Tie to VDD; Bond Pad #16 (VDD) First
BACKSIDE FINISH:
Silicon
PASSIVATION:
Type: Phosphorus Doped Silox (SiO2)
Thickness: 13kÅ ±2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm2
TRANSISTOR COUNT:
60
PROCESS:
Bulk CMOS
Metallization Mask Layout
CD4015BT
80mils
1
3
2
16
15
14
4
5
98mils
13
12
6
7
89
10
11
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
3