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ISL28117_1110 Datasheet, PDF (26/33 Pages) Intersil Corporation – 40V Precision Low Power Operational Amplifiers | |||
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ISL28117, ISL28217, ISL28417
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev. (Continued)
DATE
REVISION
CHANGE
8/31/10
FN6632.5
1. General changes:
a. Added in Quad devices to the datasheet for SOIC, TSSOP and QFN packages.
b. Added in TDFN packages for single and dual devices.
c. Added in new VOS and TCVOS limits for TDFN packages
d. Added Tja and Tjc Notes for TDFN Package which are âdirect attach (Tja) â and âbottom (Tjc)â
2. Specific changes:
a. Added in ISL28417 to title and front page info on page 1
b. Added in ISL28117FRTZ, ISL28117FRTBZ, ISL28217FRTZ, ISL28217FRTBZ, ISL28417FBZ, ISL28417FVZ,
and ISL28417FRZ packages to Ordering information on page 2 and page 2. Added in -T7 and -T7A tape and
reel extensions where applicable.
c. Added in TDFN, 14 Ld SOIC, 14 Ld TSSOP and 16 Ld QFN to pin configurations on page 3 and page 3.
d. Updated Pin Descriptions tables with new added in packages on page 4.
e. Abs Max Table added in thermal packaging info for TDFN packages on page 6.
f. Electrical Specifications Table - Added two new line items for VOS spec. TDFN package ISL28217 Grade B
limits ±70uV 25C and ±140uV full temp. TDFN package ISL28x17 Grade C limits ±150uV 25C and ±250uV full
temp on page 6 and page 8.
g. Electrical Specifications Table - Added two new line items for TCVOS spec. TDFN package ISL28217 Grade B
limits ±0.7uV/C full temp. TDFN package ISL28x17 Grade C limits ±1uV/C on page 7 and page 9.
h. Added in PODs for L8.3x3A, M14.15, M14.173, and L16.4x4
3/18/10
FN6632.4
1. Updated âOrdering Informationâ on page 2 by adding two rows for MSOP packages ISL28117FUBZ and
ISL28117FUZ, which are scheduled to release Q2 2010. Added Pinout accordingly.
2. Added POD for MSOP M8.118 to the end of datasheet
3. In âOrdering Informationâ on page 2, Separated each part number with it's own specific -T7 and -T13 suffix
and removed âAdd â-T7â or â-T13â suffix for Tape and Reel.â from Note 1.
4. Updated ±15 and ±5V Electrical Specification table with the following edits:
A) Separated VOS specs for SOIC and MSOP Grade C packages. Added new VOS specs for MSOP Grade C
package.
B) Separated TCVOS specs for SOIC and MSOP Grade C packages. Added new TCVOS specs for MSOP Grade C
package.
5. Added âThermal Informationâ on page 6 for ISL28117 MSOP package.
3/3/10
Added âRelated Literatureâ on page 1.
Added Evaluation Boards to âOrdering Informationâ on page 2.
Added Theta JC values to âThermal Informationâ on page 6. Added applicable Theta JC Note 7.
Updated Theta JA for ISL28217 8 Ld SOIC from 115°C/W to 105°C/W.
1/21/10
Part marking in âOrdering Informationâ on page 2 changed as follows:
ISL28117FBBZ changed from "28117 FBZ -B" to "28117 FBZ"
ISL28117FBZ changed from "28117 FBZ" to "28117 FBZ -C"
ISL28217FBBZ changed from "28217 FBZ -B" to "28217 FBZ"
ISL28217FBZ changed from "28217 FBZ" to "28217 FBZ -C"
12/24/09
11/25/09
On page 10: Changed label in Figure 3 from âVS = +5Vâ to âVS = ±5Vâ
On page 10: Changed label in Figure 4 from âVS = +15Vâ to âVS = ±15Vâ
Changed Typical VOS spec from â13â to â8â (B Grade), â19â to â4â (C Grade), IB from â0.18â to â0.08, IOS from
â0.3â to â0.08â. Edited Spice Schematic - L1 from â95.4957â to â15.9159Eâ, R1 from â6kâ to 1, R9 from â1â to
â2.1E3â, R10 from â1â to â2.1E3, R12 from â6kâ to â1â, L2 from â95.4957â to â15.9159Eâ. Edited Spice Net List
- Changed Revision from âAâ to âBâ, Date change from âOctober 29th 2009â to âNovember 20th 2009â, added
after AOL âSR = 0.5V/µsec, Input Stage changed in I_IOS from â0.3E-9â to 0.08E-9â, V_VOS â13e-6â to
â8e-6â, Mid supply Ref R_R9 and R_R10 changed â1â to â2.1E3â, Common Mode Gain Stage with Zero change
in G_G5 and G_G6 â5.27046e-15â to â3.162277â, R_R11 and R_R12 â6.3â to â1â, L_L1 and L_L2 â95.4957â to
â15.9159E-3â
11/12/09
FN6632.3
Updated Typical Performance Curves Figure 5, 7, 9, 11, 13, 15, 17 and 19. Added Spice Model and license
statement. Replaced typical application schematic .
26
October 13, 2011
FN6632.8
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