ISL28107_11 Datasheet, PDF (24/31 Pages) Intersil Corporation – Precision Single, Dual and Quad Low Noise Operational

ISL28107, ISL28207, ISL28407
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to Web to make sure you
have the latest Rev.
DATE REVISION
CHANGE
8/26/11
FN6631.4
• On page 2, Pin Configurations, added ISL28207 MSOP pin diagram.
• On page 3, Pin Descriptions, added ISL28207 MSOP to pin descriptions.
• On page 4, Ordering Information, added ISL28207FUZ part and information. Updated ISL28107FBZ Pkg Dwg # from
M8.118 to M8.118B. For ISL28107FRTZ and ISL28207FRTZ, updated Pkg Dwg # from L8.3x3A to L8.3x3K. For "Coming
Soon" parts: ISL28407FBZ: changed Pkg Dwg # from M14.15 to MDP0027; ISL28407FVZ: changed Pkg Dwg # from
M14.173 to MDP0044; ISL28407FRZ: changed Pkg Dwg # from 16.4x4 to L16.4x4E. ISL28207FRTZ: changed Part
Marking from 207Z to 8207. For "Coming Soon" parts: ISL28407FBZ: changed Part Marking from 28407 to 28407 FBZ.
ISL28407FVZ: changed Part Marking from 28407 to 28407 FVZ. ISL28407FRZ: changed Part Marking from 28407 to
407FRZ. Added "Coming Soon" ISL28407SOICEVAL1Z Evaluation Board.
• On page 6, Thermal Information, added ISL28207 8Ld MSOP, and ISL28407 14 Ld SOIC and 16 Ld QFN thermal
information.
• On page 6 and page 8, Electrical Specifications: for V_OS spec for ISL28207 MSOP package, added -110µV MIN, +110 µV
MAX, and -200µV MIN, +200µV MAX. For TCV_OS spec for ISL28207 MSOP package, added -0.9µV/°C MIN, +0.9µV/°C
MAX.
• On page 7 and page 8, Electrical Specifications: for TCI_B spec for ISL28207 MSOP package, added -1.5pA/°C MIN,
+1.5pA/°C MAX. For TCI_OS spec for ISL28207 MSOP package, added -1.5pA/°C MIN, +1.5pA/°C MAX.
• Updated to current Intersil datasheet template.
9/7/10
FN6631.3
1. General changes:
a. Added in ISL28407 Quad devices for SOIC, TSSOP and QFN packages.
b. Added in TDFN packages for single ISL28107 and dual ISL28207 devices.
c. Added in new VOS and TCVOS limits for TDFN packages
2. Specific changes:
a. On page 1 – Added in ISL28407 to title and front page info. Corrected Input Bias Current in Features from 60pA to 15pA
(in order to match Spec Table)
b. On page 3 - Added in ISL28107FRTZ, ISL28207FRTZ, ISL28407FBZ, ISL28407FVZ, and ISL28407FRZ packages to
Ordering information. Added in –T7, T-13 & -T7A tape and reel extensions where applicable.
c. On page 3 -Corrected part marking for ISL28207FRTZ parts from 207Z to 8207
d. On page 2 – Added in TDFN, 14 Ld SOIC, 14 Ld TSSOP and 16 Ld QFN to pin configurations.
e. On page 3 – Updated “Pin Descriptions” with newly added packages.
f. On page 6 – in “Thermal Information”, added in thermal packaging info & applicable notes for TDFN packages.
g. On page 6 and page 7 Electrical Specifications Tables – Added two new line items for VOS spec. TDFN package ISL28107
limits ±100uV 25C and ±190uV full temp. TDFN package ISL28207 limits ±100uV 25C and ±175uV full temp.
h. On page 6 and page 7 Electrical Specifications Table – Added two new line items for TCVOS spec. TDFN package ISL28107
limits ±0.9uV/C full temp. TDFN package ISL28207 limits ±0.75uV/C.
i. On page 30 to page 34 - Added in POD for L8.3x3A, M14.15, M14.173, and L16.4x4
3/9/10
FN6631.2
1. Added MSOP package to the ordering information and added applicable POD M8.118 to end of datasheet
2. Separated each part number with it's own specific -T7 and -T13 suffix. Removed “Add
“-T7” or “-T13” suffix for Tape and Reel.” from Note 1.
3. Added MSOP to the Pin Configuration and Pin Descriptions
4. Updated ±15 and ±5V Electrical Specification table with the following edits:
A) Separated VOS specs for SOIC and MSOP packages. Added new VOS specs for MSOP Grade package.
B) Separated TCVOS specs for SOIC and MSOP packages. Added new TCVOS specs for MSOP package.
5. Added Theta JA and JC for the 8 Ld MSOP package. Added Theta JC values for both SOIC package options. Changed Theta
JA for 8 Ld SOIC (ISL28207) from 115 to 105.
2/22/10
11/10/09
FN6631.1
1. Added “Related Literature*(see page 26)” on page 1.
2. Added Evaluation Boards to “Ordering Information” on page 3.
3. “Electrical Specifications” Tables, page 6 to page 9. Unbolded MIN/MAX specs with “T_A = -40°C to +85°C” conditions
(since only MIN/MAX specs with “T_A = -40°C to +125°C” conditions should be bolded, per note in common conditions)
4. Corrected Note reference in I_SC parameter on page 7 and page 9 from Note 3 to Note 9.
1. Updated VOS, IB, and IOS electrical specifications.
2. Added Typical performance curves, Figures 3 through 32.
3. Output Short Circuit Current test condition has been clarified with Note 9.
4. Updated POD.
5. Added Spice Model, associated text and Figures 58 through 68.
6. Deleted old Figures 6, 7, 8, 10, 11 and 12.
7. Added Licence Statement on page 16 and referenced in spice model.
24
FN6631.4
September 6, 2011