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ISL59533 Datasheet, PDF (23/24 Pages) Intersil Corporation – 32x32 Video Crosspoint with Differential Inputs
ISL59533
Power Dissipation and Thermal Resistance
With a large number of switches, it is possible to exceed the
150°C absolute maximum junction temperature under
certain load current conditions. Therefore, it is important to
calculate the maximum junction temperature for an
application to determine if load conditions or package types
need to be modified to assure operation of the crosspoint
switch in a safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
PDMAX
=
T----J---M-----A----X-----–-----T----A---M-----A----X--
ΘJA
Where:
• TJMAX = Maximum junction temperature = 125°C
• TAMAX = Maximum ambient temperature = 85°C
• θJA = Thermal resistance of the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the load, or:
n
∑ P DM A X
=
VS
×
ISMAX
+
i
=
1
(VS
–
VOUTi)
×
V-----O----U----T----i
RLi
Where:
• VS = Supply voltage = 5V
• ISMAX = Maximum quiescent supply current = 700mA
• VOUT = Maximum output voltage of the application = 2V
• RLOAD = Load resistance tied to ground = 150
• n = 1 to 32 channels
n
∑ P D M A X
=
VS
×
ISMAX
+
i
=
(VS
1
–
VOUTi)
×
V-----O----U----T----i =
RLi
4.8 W
The reqired θJA to dissipate 4.8W is:
ΘJA
=
T----J---M-----A----X-----–-----T----A---M-----A----X-- =
PDMAX
8.33 ( ° C /W )
Table 8 shows θJA thermal resistance results with a
Wakefield heatsink and without heatsink and various airflow.
At the thermal resistance equation shows, the required
thermal resistance depends on the maximum ambient
temperature.
TABLE 8. θJA THERMAL RESISTANCE [°C/W]
Airflow [LFM]
0
250
500
750
No Heatsink
18
14.3
13.0
12.6
Wakefield
16.0
7.0
6.0
4.7
658-25AB
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23
FN6222.0
March 13, 2006