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RFG75N05E Datasheet, PDF (2/6 Pages) Intersil Corporation – 75A, 50V, 0.008 Ohm, N-Channel Power MOSFET
RFG75N05E
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current (Current Limited by Package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic Discharge Rating, MIL-STD-883, Category B(2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD
Single Pulse Avalanche Rating (Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
RFG75N05E
50
50
75
200
±20
240
1.6
2
Refer to UIS SOA
Curves
-55 to 175
300
260
UNITS
V
V
A
A
V
W
W/oC
kV
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
Drain to Source Breakdown Voltage
BVDSS VGS = 0V, ID = 250µA (Figure 9)
50
-
-
V
Gate Threshold Voltage
VGS(TH) VGS = VDS, ID = 250µA (Figure 8)
2.0
-
4.0
V
Zero Gate Voltage Drain Current
IDSS VDS = Rated BVDSS, VGS = 0V
-
VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 150oC
-
-
1
µA
-
25
µA
Gate to Source Leakage
IGSS VGS = ±20V
-
- ±100 nA
Drain to Source on Resistance (Note 2) rDS(ON) VGS = 10V, ID = 75A (Figure 7)
-
- 0.008 Ω
Turn On Time
Turn On Delay Time
Rise Time
t(ON)
td(ON)
tr
VDD = 25V, ID ≈ 37.5A,
RL = 0.67Ω, RG = 1.67Ω, VGS = 10V,
(Figure 11)
-
-
125
ns
-
17
-
ns
-
75
-
ns
Turn Off Delay Time
td(OFF)
-
70
-
ns
Fall Time
tf
-
17
-
ns
Turn Off Time
t(OFF)
-
-
125
ns
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate Charge at 10V
Threshold Gate Charge
Junction to Case
Junction to Ambient
Qg(TOT) VGS = 0, 20V
Qg(10)
Qg(TH)
RθJC
RθJA
VGS = 0, 10V
VGS = 0, 2V
VDD = 40V, ID = 75A,
RL = 0.53Ω
IG(REF) = 3.44mA
(Figure 11)
-
-
400
nC
-
-
220
nC
-
-
15
nC
-
- 0.625 oC/W
-
-
80 oC/W
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
Source to Drain Diode Voltage
VSD
ISD = 75A
Diode Reverse Recovery Time
trr
ISD = 75A, dISD/dt = 100A/µs
NOTES:
2. Pulse test: pulse width ≤ 300µs, duty cycle ≤ 2%.
3. Repetitive pulse: pulse width is limited by maximum junction temperature.
4. Refer to Intersil Application Notes AN9321 and AN9322. See Figure 4.
-
-
1.5
V
-
-
125
ns
4-482