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ISL78307_15 Datasheet, PDF (2/9 Pages) Intersil Corporation – 40V, Low Quiescent Current, 50mA Linear Regulator for Automotive Applications
Block Diagram
VIN
ISL78307
EN
CONTROL
LOGIC
GND
THERMAL
SENSOR
REFERENCE
+
SOFT-START
+
EA
-
FET DRIVER
WITH CURRENT
LIMIT
VOUT
ADJ
Pin Configuration
ISL78307
(8 LD EPSOIC)
TOP VIEW
IN 1
NC 2
NC 3
EN 4
8 OUT
7 ADJ/NC
6 NC
5 GND
Pin Descriptions
PIN NUMBER
1
2, 3, 6
4
5
7
8
PIN NAME
IN
NC
EN
GND
ADJ/NC
OUT
EPAD
DESCRIPTION
Input voltage pin. A minimum 0.1µF X5R/X7R capacitor is required for proper operation.
Pins have internal termination and can be left unconnected. Connection to ground is optional.
High on this pin enables the device.
Ground pin.
In the adjustable output voltage option, this pin is connected to the external feedback resistor divider which sets
the LDO output voltage. In the 3.3V and 5V options, this pin is not used and can be connected to ground.
Regulated output voltage. A 10µF X5R/X7R output capacitor is required for stability.
It is recommended to solder the EPAD to the ground plane.
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
ENABLE
PIN
OUTPUT VOLTAGE
(V)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL78307FBEAZ
78307 FBEAZ
-40 to +125
Yes
3.3
8 Ld EPSOIC
M8.15B
ISL78307FBEBZ
78307 FBEBZ
-40 to +125
Yes
5.0
8 Ld EPSOIC
M8.15B
ISL78307FBECZ
78307 FBECZ
-40 to +125
Yes
ADJ
8 Ld EPSOIC
M8.15B
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL78307. For more information on MSL please see techbrief TB363.
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FN7658.3
April 7, 2015