ISL70001ASEH Datasheet, PDF (19/25 Pages) Intersil Corporation – Rad Hard and SEE Hard 6A Synchronous Buck Regulator

ISL70001ASEH
3. Place an array of thermal vias below the thermal land.
- Via array size: ~8x8=64 thermal vias
- Via diameter: ~0.3mm drill diameter with plated copper on
the inside of each via.
- Via pitch: ~1.2mm.
- Vias should drop to and contact as much buried metal area
as feasible to provide the best thermal relief.
Heat Sink Electrical Potential
The heat sink is electrically isolated and unbiased. The heatsink
may be electrically connected to any potential which offers the
best thermal relief through conductive mounting materials
(conductive epoxy, solder, etc) or may be left unbiased through
the use of electrically non-conductive mounting materials
(non-conductive epoxy, Sil-pad, kapton film, etc.).
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FN8365.0
May 22, 2013