ISL54065_0911 Datasheet, PDF (15/15 Pages) Intersil Corporation – Negative Signal Swing, Sub-ohm, Dual SPDT

ISL54065
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA _N
2X 0.10 C
12
2X 0.10 C
0.10 C
TOP VIEW
AB
E
C
A
A1
0.05 C
LEADS COPLANARITY
SIDE VIEW
(DATUM A)
PIN #1 ID
12
Ne
Nd
3
NX L
e
(DATUM B)
NX b
5
0.10 M C A B
0.05 M C
BOTTOM VIEW
CL
NX (b)
(A1)
5
SECTION "C-C"
e
CC
L
TERMINAL TIP
1.50
L12.2.2x1.4A
12 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS
SYMBOL
MIN
NOMINAL MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.15
2.20
2.25
-
E
1.35
1.40
1.45
-
e
0.40 BSC
-
k
0.20
-
-
-
L
0.35
0.40
0.45
-
N
12
2
Nd
3
3
Ne
3
3
θ
0
-
12
4
NOTES:
Rev. 0 12/06
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side, re-
spectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be ei-
ther a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
1
2.30
2
3
0.40
0.45 (12x)
0.25 (12x)
0.40
TYPICAL RECOMMENDED LAND PATTERN ₁₀
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15
FN6583.2
November 3, 2009