ISL28114_11 Datasheet, PDF (15/22 Pages) Intersil Corporation – Single, Dual, Quad General Purpose Micropower, RRIO Operational Amplifiers

ISL28114, ISL28214, ISL28414
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to Web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
5/18/11
FN6800.5
- On page 3, Pin Descriptions: Circuit 3 diagram, removed anti-parallel diodes from the IN+ to IN-
terminals.
- On page 4, Absolute Maximum Ratings: changed Differential Input Voltage from "0.5V" to "V- -
0.5V to V+ + 0.5V"
- On page 4, updated CMRR and PSRR parameters in Electrical Specifications table with test
condition specifying -40°C to 125°C typical parameter.
- On page 5, updated Note 7, referenced in MIN and MAX column headings of Electrical
Specifications table, from "Parameters with MIN and/or MAX limits are 100% tested at +25°C,
unless otherwise specified. Temperature limits established by characterization and are not
production tested." to new standard "Compliance to datasheet limits is assured by one or more
methods: production test, characterization and/or design."
- On page 9, under “Input ESD Diode Protection,” removed “They also contain back to-back
diodes across the input terminals.” Removed “Although the amplifier is fully protected, high
input slew rates that exceed the amplifier slew rate (±2.5V/µs) may cause output distortion.”
- On page 9, Figure 19: updated circuit schematic by removing back-to-back input protection
diodes.
- On page 11 replaced SPICE schematic (Figure 21)
- On page 12 replaced SPICE Netlist (Figure 22)
- On page 13 replaced Figure 24
- On page 14 replaced Figure 32
9/23/10
FN6800.4
Added new SC70 pinout package extension as follows:
Added to Related Literature on page 1 “See AN1547 for “ISL28414TSSOPEVAL1Z Evaluation
Board User’s Guide”.
Added to ordering information ISL28114FEV1Z-T7 and ISL28114FEV1Z-T7A and Evaluation
boards.
Added to Pin Configurations new pinout for ISL28114FEV1Z.
Added in Pin Descriptions ISL28114FEV1Z SC70 pin description column.
7/28/10
5/13/10
Changed Note 6 on page page 4 from “For θ_JC, the “case temp” location is the center of the
exposed metal pad on the package underside.” to
“For θ_JC, the “case temp” location is taken at the package top center.”
Added “Related Literature” on page 1.
Changed package outline drawing from MDP0038 to P5.064A on page 2 and page 18.
MDP0038 package contained 2 packages for both the 5 and 6 Ld SOT-23. MDP0038 was
obsoleted and the packages were separated and made into 2 separate package outline
drawings; P5.064A and P6.064A. Changes to the 5 Ld SOT-23 were to move dimensions from
table onto drawing, add land pattern and add JEDEC reference number.
Added Note 4 to “Ordering Information” on page 2.
12/16/09
FN6800.3
Removed “Coming Soon” from MSOP package options in the “Ordering Information” on page 2.
Updated the Theta JA for the MSOP package option from 170°C/W to 180°C/W on page 4.
11/17/09
FN6800.2
Removed “Coming Soon” from SC70 and SOT-23 package options in the “Ordering Information”
on page 2.
11/12/09
FN6800.1
Changed theta Ja to 250 from 300. Added license statement (page 10) and reference in spice
model (page 12).
10/23/09
FN6800.0
Initial Release
15
FN6800.5
June 23, 2011