ISL22317_14 Datasheet, PDF (15/15 Pages) Intersil Corporation – Low Noise, Low Power, I2C™ Bus, 128 Taps

ISL22317
Package Outline Drawing
L10.3x3B
10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD
Rev 2, 03/10
3.00
A
B
6
PIN 1
INDEX AREA
TOP VIEW
(4X) 0.15
10
6
1.64 +0.1/ -0.15
BOTTOM VIEW
6
PIN #1 INDEX AREA
1
2
4
0.25 +0.05/ - 0.07
10x 0.40 +/- 0.1
PACKAGE
OUTLINE
(10X0.25)
(10x0.40)
(10x0.20)
(8x 0.50)
1.64
TYPICAL RECOMMENDED LAND PATTERN
SEE DETAIL "X"
0.10 C
SEATING PLANE ^C
0.05
0.08 C
SIDE VIEW
C ^{0.20 REF 5}
0.05
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.18mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
15
FN6912.1
April 15, 2010