ICL7126_14 Datasheet, PDF (14/15 Pages) Intersil Corporation – 3 1/2 Digit, Low Power, Single Chip A/D Converter

Die Characteristics
DIE DIMENSIONS:
127 mils x 149 mils
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
ICL7126
PASSIVATION:
Type: PSG Nitride
Thickness: 15kÅ ±3kÅ
WORST CASE CURRENT DENSITY:
9.1 x 10⁴ A/cm²
Metallization Mask Layout
ICL7126
E₂ F₂ A₂ B₂ C₂ D₂ E₁ G₁ F₁
A₁
(14) (13) (12) (11) (10) (9) (8) (7) (6)
(5)
D₃ (15)
B₃ (16)
F₃ (17)
E₃ (18)
AB₄ (19)
POL (20)
BP/GND (21)
G₃ (22)
A₃ (23)
C₃ (24)
G₂ (25)
(4) B₁
(3) C₁
(2) D₁
(1) V+
(40) OSC 1
(39) OSC 2
(38) OSC 3
(37) TEST
V- (26)
(27)
(28) (29) (30)
(31)
(32) (33) (34) (35) (36)
INT
BUFF A/Z IN LO
IN HI COMM C_REF- C_REF+ LO HI
REF REF
14
FN3084.5