ISL28190 Datasheet, PDF (12/14 Pages) Intersil Corporation – Single and Dual Ultra-Low Noise, Ultra-Low Distortion, Rail-to-Rail, Op Amp

ISL28190, ISL28290
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
A
E
AB
6
4
PIN 1
D
REFERENCE
2X 0.15 C
1
3
2X 0.15 C
TOP VIEW
A1
e
1.00 REF
4
6
L
D2
CO.2
3
E2
DAP SIZE 1.30 x 0.76
1 _{b 6X}
0.10 M C A B
BOTTOM VIEW
0.10 C
DETAIL A
6X 0.08 C
SIDE VIEW
A3 ^C
SEATING
PLANE
L6.1.6x1.6A
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
MIN NOMINAL MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
-
D
1.55
1.60
1.65
4
D2
0.40
0.45
0.50
-
E
1.55
1.60
1.65
4
E2
0.95
1.00
1.05
-
e
0.50 BSC
-
L
0.25
0.30
0.35
-
NOTES:
Rev. 1 6/06
1. Dimensions are in mm. Angles in degrees.
2. Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.08mm.
3. Warpage shall not exceed 0.10mm.
4. Package length/package width are considered as special
characteristics.
5. JEDEC Reference MO-229.
6. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
0.127±0.008
A1
DETAIL A
0.25
0.50
0.127 +0.058
-0.008
TERMINAL THICKNESS
1.00
1.25
0.45 1.00
0.30
2.00
LAND PATTERN ⁶
12
FN6247.3
April 13, 2007