ISL28190 Datasheet, PDF (10/14 Pages) Intersil Corporation – Single and Dual Ultra-Low Noise, Ultra-Low Distortion, Rail-to-Rail, Op Amp

ISL28190, ISL28290
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Low
impedance ground plane construction is essential. Surface
mount components are recommended, but if leaded
components are used, lead lengths should be as short as
possible. The power supply pins must be well bypassed to
reduce the risk of oscillation. The combination of a 4.7µF
tantalum capacitor in parallel with a 0.01µF capacitor has
been shown to work well when placed at each supply pin.
For good AC performance, parasitic capacitance should be
kept to a minimum, especially at the inverting input. When
ground plane construction is used, it should be removed
from the area near the inverting input to minimize any stray
capacitance at that node. Carbon or Metal-Film resistors are
acceptable with the Metal-Film resistors giving slightly less
peaking and bandwidth because of additional series
inductance. Use of sockets, particularly for the SO package,
should be avoided if possible. Sockets add parasitic
inductance and capacitance which will result in additional
peaking and overshoot.
10
FN6247.3
April 13, 2007