HCTS299MS Datasheet, PDF (12/13 Pages) Intersil Corporation – Radiation Hardened 8-Bit Universal Shift Register; Three-State

Die Characteristics
DIE DIMENSIONS:
123 x 94 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS299MS
HCTS299MS
OE2 (3)
I/O6 (4)
I/O4 (5)
I/O2 (6)
I/O0 (7)
Q0 (8)
(18) DS7
(17) Q7
(16) I/O7
(15) I/O5
(14) I/O3
(13) I/O1
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS299 is TA14480A.
Spec Number 518640
635