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ISL59483 Datasheet, PDF (11/17 Pages) Intersil Corporation – Dual, 500MHz Triple, Multiplexing Amplifiers
ISL59483
Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = +25°C, unless otherwise specified. (Continued)
HIZ
50Ω
TERM.
VIN = 0V
HIZ
50Ω
TERM.
VIN = 0V
0
0
VOUT A, B, C
10ns/DIV
FIGURE 36. MUX 1: HIZ SWITCHING GLITCH VIN = 0V
0
0
VOUT A, B, C
20ns/DIV
FIGURE 37. MUX 2: HIZ SWITCHING GLITCH VIN = 0V
HIZ
50Ω
TERM.
VIN=1V
0
VOUT A, B, C
0
10ns/DIV
FIGURE 38. MUX 1: HIZ TRANSIENT RESPONSE VIN = 1V
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
6
5
4.34W
4
3
QFN48
θJA = +23°C/
2
1
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
11
HIZ
50Ω
TERM.
VIN = 1V
0
VOUT A, B, C
0
20ns/DIV
FIGURE 39. MUX 2: HIZ TRANSIENT RESPONSE VIN = 1V
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
1.2
1.0
870mW
0.8
0.6
QFN48
θJA =+ 115°C/
0.4
0.2
0.0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 41. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN6394.1
December 22, 2006