ISL29029_14 Datasheet, PDF (11/16 Pages) Intersil Corporation – Low Power Ambient Light and Proximity Sensor with Intelligent Interrupt and Sleep Modes

ISL29029
Soldering Considerations
Convection heating is recommended for reflow soldering; direct-
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is qualified to
+260°C. A standard reflow soldering profile with a +260°C
maximum is recommended.
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting.
(http://www.intersil.com/data/tb/TB477.pdf)
Layout Considerations
The ISL29029 is relatively insensitive to layout. Like other I²C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I²C traces as far as possible from all sources of
noise. A 0.1µF and 1µF power supply decoupling capacitors need to be
placed close to the device.
R1
10kΩ
R2
R3
10kΩ 10kΩ
V_{I2C_PULL-UP}
V_DD
V_IR-LED
C1
1µF
C2
0.1µF
SLAVE_0
1 _{ADDR0 IRDR} 8
2 _VDD
3 _GND
4
REXT
7
INT
SDA ⁶
5
SCL
REXT ISL29029
499kΩ
SLAVE_1
SDA
SCL
I²C SLAVE_n
SDA
SCL
FIGURE 5. ISL29029 TYPICAL CIRCUIT
I²C MASTER
MICROCONTROLLER
INT
SDA
SCL
11
FN7682.0
November 23, 2010