ISL29001 Datasheet, PDF (10/11 Pages) Intersil Corporation – Light-to-Digital Sensor

Typical Circuit
A typical application circuit is shown in Figure 14.
ISL29001
2.5V TO 3.3V
+
4.7µF
0.1µF
ISL29002
VDD
SDA
SCL
ISL29001
VSS
PD
REXT
100k
MICROCONTROLLER
SDA
SCL
FIGURE 14. TYPICAL CIRCUIT
Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence
with package pads. The large, exposed central die-mounting
paddle in the center of the package requires neither thermal
nor electrical connection to the PCB, and such connection
should be avoided.
Layout Considerations
The ISL29001 is relatively insensitive to layout. Like other
I²C devices, it is intended to provide excellent performance
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I²C traces as far as possible from all
sources of noise. Use two power-supply decoupling
capacitors, 4.7µF and 0.1µF, placed close to the device.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The ISL29001’s
plastic ODFN package does not require a custom reflow
soldering profile, and is qualified to +260°C. A standard
reflow soldering profile with a +260°C maximum is
recommended.
Special Handling
ODFN6 is rated as JEDEC moisture level 4. Standard
JEDEC Level 4 procedure should be followed: 72hr floor life
at less than +30°C 60% RH. When baking the device, the
temperature required is +110°C or less due to special
molding compound.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
FN6166.6
December 10, 2008