HCTS574MS Datasheet, PDF (10/11 Pages) Intersil Corporation – Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered

Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
D0
(2)
HCTS574MS
HCTS574MS
OE
VCC
Q0
(1)
(20)
(19)
D1 (3)
D2 (4)
D3 (5)
D4 (6)
D5 (7)
D6 (8)
(18) Q1
(17) Q2
(16) Q3
(15) Q4
(14) Q5
(13) Q6
(9)
(10)
(11)
(12)
D7
GND
CP
Q7
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS574 is TA14460A.
Spec Number 518629
703