HCTS244MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Octal Buffer/Line Driver, Three-State

HCTS244MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: Al/Sil
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS244MS
2Y3
1A0
1OE
VCC
2OE
(3)
(2)
(1)
(20)
(19)
1A1 (4)
2Y2 (5)
1A2 (6)
(18) 1Y0
(17) 2A3
(16) 1Y1
(15) 2A2
2Y1 (7)
(14) 1Y2
(8)
(9)
1A3
2Y0
(10)
(11)
GND
2A0
(12)
(13)
1Y3
2A1
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS244 is TA14402A.
Spec Number 518616
611