HCTS190MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Synchronous 4-Bit Up/Down Counter

Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS190MS
HCTS190MS
Q0 (3)
CE (4)
U/D (5)
Q2 (6)
Q3 (7)
(15) P0
(14) CP
(13) RC
(12) TC
(11) PL
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS190 is TA14444A.
Spec Number 518614
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