HCS253MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Dual 4-Input Multiplexer

Die Characteristics
DIE DIMENSIONS:
84 x 84 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS253MS
HCS253MS
I3 1 (3)
I2 1 (4)
I1 1 (5)
I0 1 (6)
(14) S0
(13) 2 I3
(12) 2 I2
(11) 2 I1
(10) 2 I0
Spec Number 518765
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