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| HCS240MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Octal Buffer/Line Driver, Three-State | |||
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Die Characteristics
DIE DIMENSIONS:
108 x 106 x 19 ± 1mils
METALLIZATION:
Type: Si - Al
Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105 A/cm2
BOND PAD SIZE:
4 x 4 (mils)
100 x 100µm
Metallization Mask Layout
HCS240MS
HCS240MS
AI2 (4)
BO3 (5)
AI3 (6)
BO2 (7)
(18) AO1
(17) BI4
(16) AO2
(15) BI3
(14) AO3
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiï¬cation.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciï¬cations at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518837
10
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