CD4555BMS Datasheet, PDF (10/11 Pages) Intersil Corporation – CMOS Dual Binary to 1 of 4 Decoder/Demultiplexers

CD4555BMS, CD4556BMS
TRUTH TABLE
INPUTS
Q OUTPUTS
E D C B A 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
000001000000000000000
000010100000000000000
000100010000000000000
000110001000000000000
001000000100000000000
001010000010000000000
001100000001000000000
001110000000100000000
010000000000010000000
010010000000001000000
010100000000000100000
010110000000000010000
011000000000000001000
011010000000000000100
011100000000000000010
011110000000000000001
1XXX0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
X = Don’t Care
Chip Dimensions and Pad Layouts
CD4555BMSH
CD4556BMSH
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-1258