ISL5571A Datasheet, PDF (1/12 Pages) Intersil Corporation – Access High Voltage Switch

®
Data Sheet
January 2004
ISL5571A
FN4920.4
Access High Voltage Switch
The ISL5571A is a solid state device designed to replace the
electromechanical relay used on Subscriber Line Cards. The
device contains two Line Break MOSFET switches, one Ring
Return MOSFET switch and one Ring Access SCR switch.
The ISL5571A is pin-for-pin compatible with the Lucent
L7581AAE LCAS and Clare CPCL7581A Products.
Improvements include: line break switches r_ON match (0.5Ω
Max) higher dV/dt sensitivity (5000V/µs), protection SCR
hold current set to 110mA.
The line break MOSFETs have very low on resistance
(<16.0Ω Typ) and Ron match (<0.05Ω Typ, 0.5Ω Max) and a
blocking voltage >330V. The Ring Return MOSFET has a
typical Ron of 50Ω and a blocking voltage >330V. The
Ringing Access switch is implemented with a SCR device
with a blocking voltage >480V. The SCR switch inherently
offers low EMI connect and disconnect circuitry. All control
I/Os use TTL thresholds making the device compatible with
3V logic.
The ISL5571A also includes on-chip protection in the form of
an over-voltage clamping circuit, current-limited MOSFET
switches, and thermal shutdown circuitry. The over-voltage
clamping circuit consists of a diode bridge and SCR.
Ordering Information
PART
NUMBER
ISL5571AIB
PROT
SCR
Yes
TEMP
RANGE
(^oC)
PACKAGE PKG. DWG.
TYPE
#
-40 to 85 16 Ld SOIC M16.3
Pinout
ISL5571A
TOP VIEW
F_GND 1
T_BAT 2
T_LINE 3
NC 4
NC 5
T_RING 6
V_DD 7
T_SD 8
16 V_BAT
15 R_BAT
14 R_LINE
13 NC
12 R_RING
11 LATCH
10 INPUT
9 D_GND
Features
• Small Size/Surface-Mount Packaging
• Low Impulse Noise, Low EMI
• Clean, Bounce-Free Switching
• Line Break Switches
- 0.5Ω Max r_ON Match
- 28Ω Max r_ON
• Built-In Current Limiting, Thermal Shutdown and
Secondary Protection for the SLIC
• Optimized for Short Loop High REN Applications
• 3V/5V Logic-Capable I/O
Applications
• Central Office
• PBX
• DLC
• HFC
• FITL
• DAML
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB379 “Thermal Characterization of
Packages for ICs”
• Texas Instruments TISPL758LF3D Data Sheet
• Teccor Electronics Document DO-214AA
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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