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HC55185_06 Datasheet, PDF (1/20 Pages) Intersil Corporation – VoIP Ringing SLIC Family
HC55185
®
Data Sheet
December 18, 2006
FN4831.14
VoIP Ringing SLIC Family
The RSLIC-VoIP family of
ringing subscriber line
interface circuits (RSLIC)
supports analog Plain Old
Telephone Service (POTS) in
short and medium loop length, wireless and wireline
applications. Ideally suited for remote subscriber units, this
family of products offers flexibility to designers with high
ringing voltage and low power consumption system
requirements.
The RSLIC-VoIP family operates to 100V which translates
directly to the amount of ringing voltage supplied to the end
subscriber. With the high operating voltage, subscriber loop
lengths can be extended to 500Ω (i.e., 5,000 feet) and
beyond.
Other key features across the product family include: low
power consumption, ringing using sinusoidal or trapezoidal
waveforms, robust auto-detection mechanisms for when
subscribers go on or off hook, and minimal external discrete
application components. Integrated test access features are
also offered on selected products to support loopback
testing as well as line measurement tests.
There are five product offerings of the HC55185 with each
version providing voltage grades of high battery voltage and
longitudinal balance. The voltage feed amplifier design uses
low fixed loop gains to achieve high analog performance
with low susceptibility to system induced noise.
Block Diagram
POL CDC
VBL VBH
ILIM
DC
CONTROL
BATTERY
SWITCH
RINGING
PORT
VRS
TIP
RING
TL
2-WIRE
PORT
TRANSIENT
CURRENT
LIMIT
TRANSMIT
SENSING
SW+
SW-
TEST
ACCESS
DETECTOR
LOGIC
RTD RD E0 DETALM
4-WIRE
PORT
VRX
VTX
-IN
VFB
CONTROL
LOGIC
F2
F1
F0
BSEL SWC
Features
• Onboard Ringing Generation
• Compatible with Existing HC5518x Devices
• Low Standby Power Consumption (75V, 65mW)
• Reduced Idle Channel Noise
• Programmable Transient Current Limit
• Improved Off Hook Software Interface
• Integrated MTU DC Characteristics
• Low External Component Count
• Silent Polarity Reversal
• Pulse Metering and On Hook Transmission
• Tip Open Ground Start Operation
• Balanced and Unbalanced Ringing
• Thermal Shutdown with Alarm Indicator
• 28 Lead Surface Mount Packaging
• Reduced Footprint Micro Leadframe Packaging
• Dielectric Isolated (DI) High Voltage Design
• QFN Package Option
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat
No Leads - Product Outline
- Near Chip Scale Package Footprint; Improves PCB
efficiency and has a thinner profile
• Pb-free plus anneal available (RoHS compliant)
Applications
• Voice Over Internet Protocol (VoIP)
• Cable Modems
• Voice Over DSL (VoDSL)
• Short Loop Access Platforms
• Remote Subscriber Units
• Terminal Adapters
Related Literature
• AN9814, User’s Guide for Development Board
• AN9824, Modeling of the AC Loop
• Interfacing to DSP CODECs (Contact Factory)
• TB379 Thermal Characterization of Packages for ICs
• AN9922, Thermal Characterization and Modeling of the
RSLIC18 in the Micro Leadframe Package
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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