D865GSA Datasheet, PDF (66/94 Pages) Intel Corporation – Technical Product Specification

Intel Desktop Board D865GSA Technical Product Specification
2.11 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 ^oC at the processor fan
inlet is a requirement. Use a processor heatsink that provides omni-directional airflow
(similar to the type shown in Figure 17) to maintain required airflow across the
processor voltage regulator area.
OM16996
Figure 17. Processor Heatsink for Omni-directional Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.13.
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