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82599_10 Datasheet, PDF (4/4 Pages) Intel Corporation – Transforming the data center through a reliable and unified 10GbE network | |||
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Features
Unified Networking Features
FCoE Tx/Rx CRC offload
FCoE Coalescing and Direct data placement
iSCSI Acceleration
iSCSI boot
Benefits
⢠Offloads receive FC CRC integrity check while tracking the CRC bytes and FC padding bytes
⢠Saves CPU cycles by reducing the data copy and also minimizes CPU processing by posting
only the packetâs headers that are required for software
⢠L ower processor utilization using TCP checksum offloading
⢠Increased throughput through TCP Segmentation Offload
⢠TCP Receive-Side Coalescing
⢠Enables system boot up via iSCSI
⢠Provides additional network management capability
Manageability Features
DMTF NC-SI pass through
SMBus pass through
Advanced filtering capabilities (IPv4, IPv6)
Preboot eXecution Environment (PXE) flash interface support
Simple Network Management Protocol (SNMP) and Remote
Network Monitoring (RMON) statistic counters
Wake-on-LAN support
MDIO â internal management interface
⢠Industry standard for BMC interface
⢠Allows fast data rates (up to 100 Mb/s full duplex)
⢠Better capabilities (video redirection)
⢠Extended filtering capabilities
⢠Supports pass through over the SMBus interface
⢠Supports data rates of up to 400 KHz
⢠Allows serial redirection and IPMI traffic redirection to BMC
⢠Supports extended L2, L3 and L4 filtering for traffic routing to BMC
⢠Supports MAC address, VLAN, ARP, IPv4, IPv6, RMCP UDP ports, UDP/TCP ports filtering
⢠Supports flexible header filtering
⢠Allows the BMC to share the MAC address with the host OS
⢠Enables system boot up via the LAN (32 bit and 64 bit)
⢠Flash interface for PXE image
⢠Easy system monitoring with industry-standard consoles
⢠Packet recognition and wake-up for LAN on motherboard applications
without software configuration
⢠Enables the MAC and software to monitor and control the PHY
Additional Device Features
Four outputs on each port that directly drive LEDs
JTAG (IEEE 1149.1*) test access port built-in silicon
⢠Link and activity indications on each port
⢠Simplified testing using boundary scan
⢠Supports the IDCODE instruction
Characteristics
Electrical
Typical targeted power dissipation
Environmental
Operating temperature
Physical
Implemented in 65nm complementary metal-oxide
semiconductor (CMOS) process
Package
⢠5.1W (10GBase-KX4)
⢠5.5W (10GBase-KR)
⢠0° to 70° C (with thermal management)
⢠Offers lowest geometry to minimize power and size while maintaining quality and reliability
⢠25 mm x 25 mm 576-pin Flip-Chip Ball Grid Array (FC-BGA) package
Order Codes
82599EB (Base SKU) â JL82599EB
82599ES (Serial SKU) â JL82599ES
To see the full line of Intel Ethernet Controllers, visit www.intel.com/network/connectivity
For more information, contact your Intel sales representative.
Î Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.
1 Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other
benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.
2 VMDq requires a virtualization operating system that supports VMDq.
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SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF
INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL MAY MAKE CHANGES TO SPECIFICATIONS, PRODUCT DESCRIPTIONS, AND PLANS AT
ANY TIME, WITHOUT NOTICE.
Copyright © 2009 Intel Corporation. All rights reserved.
Intel, the Intel logo, and Xeon are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Printed in USA
1211/TAR/SWU/PDF
Please Recycle
321731-002US
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