28F800C3 Datasheet, PDF (1/68 Pages) Intel Corporation – Advanced+ Boot Block Flash Memory (C3)

Intel^£ Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
■ Flexible SmartVoltage Technology
— 2.7 V– 3.6 V Read/Program/Erase
— 12 V for Fast Production Programming
■ 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
— Reduces Overall System Power
■ High Performance
— 2.7 V– 3.6 V: 70 ns Max Access Time
■ Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword Blocks, Top or Bottom
Parameter Boot
— Up to One Hundred-Twenty-Seven 32
Kword Blocks
— Fast Program Suspend Capability
— Fast Erase Suspend Capability
■ Flexible Block Locking
— Lock/Unlock Any Block
— Full Protection on Power-Up
— WP# Pin for Hardware Block Protection
■ Low Power Consumption
— 9 mA Typical Read
— 7 A Typical Standby with Automatic
Power Savings Feature (APS)
■ Extended Temperature Operation
— –40 °C to +85 °C
■ 128-bit Protection Register
— 64 bit Unique Device Identifier
— 64 bit User Programmable OTP Cells
■ Extended Cycling Capability
— Minimum 100,000 Block Erase Cycles
■ Software
— Intel^® Flash Data Integrator (FDI)
— Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
— Intel Basic Command Set
— Common Flash Interface (CFI)
■ Standard Surface Mount Packaging
— 48-Ball µBGA*/VFBGA
— 64-Ball Easy BGA Packages
— 48-Lead TSOP Package
■ ETOX™ VIII (0.13 µm) Flash
Technology
— 16, 32 Mbit
■ ETOX™ VII (0.18 µm) Flash Technology
— 16, 32, 64 Mbit
■ ETOX™ VI (0.25 µm) Flash Technology
— 8, 16 and 32 Mbit
The Intel^® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power applications.
The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-
speed, low-power operation. Flexible block locking allows any block to be independently locked
or unlocked. Add to this the Intel^® Flash Data Integrator (FDI) software and you have a cost-
effective, flexible, monolithic code plus data storage solution. Intel^® Advanced+ Boot Block Flash
Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel^®
Flash website: http://www.intel.com/design/flash.
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
Order Number: 290645-017
October 2003