28F008C3 Datasheet, PDF (1/59 Pages) Intel Corporation – 3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

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PRODUCT PREVIEW
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
n Flexible SmartVoltage Technology
 2.7 V–3.6 V Read/Program/Erase
 2.7 V or 1.65 V I/O Option Reduces
Overall System Power
 12 V for Fast Production
Programming
n High Performance
 2.7 V–3.6 V: 90 ns Max Access Time
 3.0 V–3.6 V: 80 ns Max Access Time
n Optimized Architecture for Code Plus
Data Storage
 Eight 8-Kbyte Blocks,
Top or Bottom Locations
 Up to Sixty-Three 64-KB Blocks
 Fast Program Suspend Capability
 Fast Erase Suspend Capability
n Flexible Block Locking
 Lock/Unlock Any Block
 Full Protection on Power-Up
 WP# Pin for Hardware Block
Protection
 VPP = GND Option
 VCC Lockout Voltage
n Low Power Consumption
 9 mA Typical Read Power
 10 µA Typical Standby Power with
Automatic Power Savings Feature
n Extended Temperature Operation
 –40 °C to +85 °C
n Easy-12 V
 Faster Production Programming
 No Additional System Logic
n 128-bit Protection Register
 64-bit Unique Device Identifier
 64-bit User Programmable OTP
Cells
n Extended Cycling Capability
 Minimum 100,000 Block Erase
Cycles
n Flash Data Integrator Software
 Flash Memory Manager
 System Interrupt Manager
 Supports Parameter Storage,
Streaming Data (e.g., voice)
n Automated Word/Byte Program and
Block Erase
 Command User Interface
 Status Registers
n SRAM-Compatible Write Interface
n Cross-Compatible Command Support
 Intel Basic Command Set
 Common Flash Interface
n x 16 for High Performance
 48-Ball µBGA* Package
 48-Lead TSOP Package
n x 8 I/O for Space Savings
 48-Ball µBGA* Package
 40-Lead TSOP Package
n 0.25 µ ETOX™ VI Flash Technology
The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
May 1998
Order Number: 290645-001