TLE8108EM Datasheet, PDF (9/30 Pages) Infineon Technologies AG – Smart 8-Channel Low Side Relay Driver with SPI Interface

TLE 8108 EM
Smart 8-Channel Low Side Switch
General Product Characteristics
4.2
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information go to www.jedec.org.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
4.2.1
4.2.2
Junction to Case
Junction to Ambient (2s2p)
R_thJC
-
R_thJA
-
-
7
40
-
K/W
K/W
P_TOT = 1W ^{1) 2) 3)}
P_TOT = 1W ^{1) 2) 3)}
1) Not subject to production test, specified by design.
2) Homogenous power distrubution over all channels (all power stages equally heated), dependent on cooling setup.
3) Refer to Figure 3 for the setup.
Dimensions:
Metallization:
Thermal Vias:
76.2 x 114.3 x 1.5 mm³ , FR4
JEDEC 2s2p (JESD 51-7) + (JESD 51-5)
F =0.3mm; plating 25µm; 10 pcs. for PG-SSOP-24
70µm modeled (traces)
35µm, 90% metallization
35µm, 90% metallization
70µm, 5% metallization
Figure 3 PG-SSOP-24 PCB setup
Data Sheet
9
Rth PCB setup.vsd
Rev. 1.0, 2011-03-23