PTAC260302SC Datasheet, PDF (9/10 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FET

PTAC260302SC
Package Outline Specifications
Package H-37248H-4 (formed leads)
;'ƒ[
>@

>@

>@
'
'
&/

>@
&/
“
>“@

 _> _@
“
>“@
;5
_> 5 _@
“
>“@
*
*
&/
;
>@
;
>@
“
>“@
;ƒ“ƒ

>@
;“
>“@63+
++B*:BSRBB

>@
6
Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ± 0.127 [.005] unless specified otherwise.
4. Pins: D1, D2 – drains; G1, G2 – gates; S – source.
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch].
(Find the latest and most complete information about products and packaging at the Infineon Internet page
(http://www.infineon.com/rfpower )
Data Sheet
9 of 10
Rev. 02.1, 2013-08-28