BFR740L3 Datasheet, PDF (8/9 Pages) Infineon Technologies AG – NPN Silicon Germanium RF Transistor

Package TSLP-3-8
Package Outline
3
1
2
Top view
0.39
+0.01
-0.03
0.05 MAX.
Bottom view
0.6 ±0.05
0.5 ±0.0351)
3
Pin 1
marking
2
1
0.35 ±0.05
2 x 0.15 ±0.0351)
Foot Print
1) Dimension applies to plated terminal
For board assembly information please refer to Infineon website "Packages"
0.6
R0.19 ^0.5
Marking Layout
0.225
0.15
0.225
Copper Solder mask
0.2
R0.1
0.2
0.17
Stencil apertures
Type code
Laser marking
BFR740L3
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
0.5
Pin 1
marking
0.76
8
2005-10-17