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SGP20N60HS_09 Datasheet, PDF (7/12 Pages) Infineon Technologies AG – High Speed IGBT in NPT-technology 30% lower Eoff compared to previous generation
2,0m J
*) E on include losses
due to diode recovery
1,0m J
SGP20N60HS
SGW20N60HS
*) Eon include losses
E ts*
due to diode recovery
E on*
1,0 mJ
E off
0,5 mJ
E ts *
Eon*
E off
0,0m J
0A
10A
20A
30A
40A
IC, COLLECTOR CURRENT
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, TJ=150°C,
VCE=400V, VGE=0/15V, RG=16Ω,
Dynamic test circuit in Figure E)
0,0 mJ
0Ω
10Ω
20Ω
30Ω
40Ω
RG, GATE RESISTOR
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, TJ=150°C,
VCE=400V, VGE=0/15V, IC=20A,
Dynamic test circuit in Figure E)
*) Eon include losses
due to diode recovery
0,75mJ
Ets*
0,50mJ
Eon*
0,25mJ Eoff
0,00mJ
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
Figure 15. Typical switching energy losses
as a function of junction
temperature
(inductive load, VCE=400V,
VGE=0/15V, IC=20A, RG=16Ω,
Dynamic test circuit in Figure E)
100K/W
D=0.5
0.2
10-1K/W 0.1
0.05
0.02
10-2K/W
0.01
10-3K/W
single pulse
R,(K/W)
0.1882
0.3214
0.1512
0.0392
τ, (s)
0.1137
2.24*10-2
7.86*10-4
9.41*10-5
R1
R2
C1=τ1/R1 C2=τ2/R2
10-4K/W
1µs 10µs 100µs 1ms 10ms 100ms
tP, PULSE WIDTH
Figure 16. IGBT transient thermal resistance
(D = tp / T)
Power Semiconductors
7
Rev 2.5 Nov 09