HYS64D64020GDL Datasheet, PDF (7/27 Pages) Infineon Technologies AG – 200-Pin Small Outline Dual-In-Line Memory Modules

HYS64D64020[H/G]DL–[5/6]–B
Small Outline DDR SDRAM Modules
Overview
Table 2
Type
Ordering Information
Compliance Code
Description
SDRAM
Technology
PC3200 (CL=3.0)
HYS64D64020GDL–5–B
PC2700 (CL=2.5)
HYS64D64020GDL–6–B
PC32100S–3033–1–A1 two ranks 512MB SO-DIMM
PC2700S–2533–0–A1 two ranks 512MB SO-DIMM
512 MB (×16)
512 MB(×16)
PC3200 (CL=3.0)
HYS64D64020HDL–5–B
PC2700 (CL=2.5)
HYS64D64020HDL–6–B
PC32100S–3033–1–A1 two ranks 512MB SO-DIMM
PC2700S–2533-0–A1 two ranks 512MB SO-DIMM
512 MB (×16)
512 MB(×16)
Notes
1. All part numbers end with a place code designating the silicon-die revision. Reference information available on
request. Example: HYS64D64020[H/G]DL–5–B, indicating rev. B dies are used for SDRAM components.
2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the
latencies and SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD¹⁾ latency of
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
1) RCD: Row-Column-Delay
Data Sheet
7
Rev. 1.0, 2004-05