BFR750L3RH Datasheet, PDF (7/8 Pages) Infineon Technologies AG – NPN Silicon Germanium RF Transistor

Package TSLP-3-9
Package Outline
Top view
3
1
2
Pin 1
marking
0.31_-+00..0021
Bottom view
0.6 ±0.05
0.5 ±0.0351)
3
2
1
0.35 ±0.05
2 x 0.15 ±0.0351)
Foot Print
1) Dimension applies to plated terminal
For board assembly information please refer to Infineon website "Packages"
0.6
R0.19 ^0.5
BFR750L3RH
0.225
0.15
0.225
Copper Solder mask
Marking Layout (Example)
0.2
R0.1
0.2
0.17
Stencil apertures
BFR705L3RH
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
0.35
Pin 1
marking
0.8
7
2007-04-26