CGY353 Datasheet, PDF (6/6 Pages) Infineon Technologies AG – GaAs MMIC

Package Outlines
MW-16
(Special Package)
7
7 x 0.8 = 5.6
D
1.6 max
0.1 max
1.4 ±0.1
H
GaAs Components
CGY 353
0.35±0.05
0.2 M A-B D C
B
4x
0.2 A-B D H
16x
0.2 D
0.15
+0.05
-0.06
0˚...7˚
C
16x
0.1 C
A
0.8
Exposed solderable
heatsink ø4.57 ±0.05
Sorts of Packing
Package outlines for tubes, trays etc. are contained in
our Data Book “Package Information”.
SMD = Surface Mounted Device
Data Sheet
6
Dimensions in mm
2001-01-01