BFR193L3_12 Datasheet, PDF (5/6 Pages) Infineon Technologies AG – For low noise, high-gain amplifiers up to 2 GHz

Package TSLP-3-1
Package Outline
3
1
2
Top view
0.4 ^+0.1
0.05 MAX.
Bottom view
0.6 ±0.05
0.5 ±0.0351)
3
Pin 1
marking
2
1
0.35 ±0.05
2 x 0.15 ±0.0351)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
0.225
0.15
0.225
Copper Solder mask
Marking Layout (Example)
0.2
R0.1
0.2
0.17
Stencil apertures
BFR193L3
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
0.5
Pin 1
marking
0.76
5
BFR193L3
2012-08-08