TLE6214L_04 Datasheet, PDF (3/22 Pages) Infineon Technologies AG – Smart Dual Current Sense Switch

Thermal resistance
junction - case
junction - ambient @ min. footprint
junction - ambient @ 6 cm² cooling area¹
Datasheet TLE 6214 L
R_thJC
R_thJA
2
105
45
K/W
K/W
K/W
PCB with min footprint
PCB with 6 cm² copper cooling area
Electrical Characteristics
Parameter and Conditions
V_S = 4.5V – 5.5V ; T_j = - 40 °C to + 150 °C
(unless otherwise specified)
Symbol
1. Power Supply
Supply Voltage
Supply Current
Supply Current in Sleep Mode (CS = H)
Wake up Time (after sleep mode)²
2. Power Outputs
ON Resistance V_S = 5 V; I_D = 2 A
T_J = 25°C
T_J = 125°C
T_J = 150°C
Output Clamping Voltage
output OFF
Current Limit 1: Current limitation
Current Limit 2 :Overload switch off
V_S >= 5V
V_S < 5V, T_J <= 125°C
V_S < 5V, T_J > 125°C ²
Reverse Current per channel^2,3
Output Leakage Current
Sleep mode active
Turn-On Time 1
Turn-On Time 2
Turn-Off Time 1
Turn-Off Time 2
I_D = 2 A, resistive load
I_D = 2 A, resistive load
I_D = 2 A, resistive load
I_D = 2 A, resistive load
V_S
I_S
I_S(sleep)
t_wake
R_DS(ON)
V_DS(AZ)
I_D(lim1)
I_D(lim2)
I_rev
I_D(lkg)
t_ON
t_OFF
Values
min typ
4.5 --
--
--
--
--
0.18
--
0.27
--
0.3
48 --
5
6.5
9
10,5
9
8
--
--
--
5
20
--
5
20
Unit
max
5.5
V
5
mA
10
µA
100
µs
0.22
Ω
0.32
0.36
60
V
8
A
A
12
12
12
2
A
5
µA
10
µs
50
10
µs
50
1 _{Device mounted on PCB (50mm x 50mm x 1,5mm epoxy, FR4) with 6cm2 copper heatsink area (one layer, 70µm thick); PCB in test cham-}
ber with blown air
2 _{This parameter is not subject to production test}
3 _{without loss of function, supply current can be IS > 5mA}
V3.0
Page 3
18.10.2004