TLE7257 Datasheet, PDF (25/31 Pages) Infineon Technologies AG – LIN Transceiver

TLE7257
Application Information
7.2
ESD Susceptibility according to IEC61000-4-2
Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330 Ω) have been performed. The results
and test conditions are available in a separate test report.
Table 7 ESD Susceptibility according to IEC61000-4-2
Performed Test
Result Unit
Electrostatic discharge voltage at pin V_S, BUS versus GND
+10
kV
Electrostatic discharge voltage at pin V_S, BUS versus GND
-10
kV
1) ESD susceptibility “ESD GUN” according IEC 61000-4-2, tested by external test house.
Remarks
1)_{Positive pulse}
1)_{Negative pulse}
7.3
Transient Robustness according to ISO 7637-2
Test for transient robustness according to ISO 7637-2 have been performed. The results and test conditions are
available in a separate test report.
Table 8 Automotive Transient Robustness according to ISO 7637-2
Performed Test
Result Unit
Pulse 1
-100
V
Pulse 2
+75
V
Pulse 3a
-150
V
Pulse 3b
+100
V
1) Automotive Transient Robustness according to ISO 7637-2, tested by external test house.
Remarks
1)
1)
1)
1)
7.4
LIN Physical Layer Compatibility
The TLE7257 fulfills the Physical Layer Specification of LIN 1.2, 1.3, 2.0, 2.1, 2.2 and 2.2A.
The differences between LIN specification 1.2 and 1.3 is mainly the physical layer specification. The reason was
to improve the compatibility between the nodes.
The LIN specification 2.0 is a super set of the 1.3 version. The 2.0 version offers new features. However, it is
possible to use the LIN 1.3 slave node in a 2.0 node cluster, as long as the new features are not used. Vice versa
it is possible to use a LIN 2.0 node in the 1.3 cluster without using the new features.
In terms of the physical layer the LIN 2.1, LIN 2.2 and LIN 2.2A Specification does not include any changes and
is fully compliant to the LIN Specification 2.0.
LIN 2.2A is the latest version of the LIN specification, released in December 2010. The physical layer specification
of LIN 2.2A will be included in the ISO 17987-4 without modifications.
Additionally, the TLE7257 is compliant to the SAE J2602-2 standard for usage in the US automotive market.
7.5
TxD Fail-Safe Input
The TxD input has an internal pull-up structure to avoid any bus disturbance in case the TxD input is open and
floating. In case of an not connected TxD input, the pin is pulled to an internal voltage supply (see Figure 1) and
the output to the LIN bus on the BUS pin is always “recessive”. Therefore the TLE7257 can not disturb the
communication on the LIN bus.
In order to optimize the quiescent current of the TLE7257 in Sleep mode, the pull-up structure inside the TxD input
is disabled in Sleep mode. The logic inside the TxD input is not reacting at any signal change provide to the TxD
input pin and the transmitter is turned off. In Sleep mode the TLE7257 can not disturb or block the LIN bus in any
case.
Data Sheet
25
Rev. 1.0, 2013-10-16