V23833-G2104-A001 Datasheet, PDF (23/28 Pages) Infineon Technologies AG – XPAK 1310 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3

Host Board Layouts
41.91
[1.65]
35.51
[1.398]
29.6
14.8
13.8 13.4
∅1.55±0.05
13.4 13.8
V23833-Gx104-A0x1
Application Notes
10x ∅2±0.08 [.079±.003]
⊕ ∅0.15 [.006] G H J
0.5±0.03 (70x)
35.51
[1.398]
40.23
[1.584]
H
38.1
[1.5]
J
4.24
[.167]
PAD DETAIL
0.8 (34x)
PAD SPACING
G
Dimensions in mm [inches]
41.91
[1.65]
1) Tall profile
2) Low profile
3) Flangeless
1.02 [.04] ^{1) 2)}
0.51 [.02] ³⁾
25.3±0.12 [.996±.005] ¹⁾
12.85±0.12 [.506±.005] ²⁾
10.31±0.12 [.406±.005] ³⁾
⊕ ∅0.25 [.01] G H J
39.12±0.12 [1.54±.005] ^{1) 2)}
36.5±0.12 [1.437±.005] ³⁾
File: 2504
Figure 7 Host PCB, Board Connector Layout and Bezel Opening
Preliminary Product Information
23
2004-05-13