V23833-G2104-A001 Datasheet, PDF (2/28 Pages) Infineon Technologies AG – XPAK 1310 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3

V23833-Gx104-A0x1
Applications
• DOM
– Loss Of Signal from receiver
– Laser safety alarm (with reset function)
– Supply voltage monitor (+3.3 V, Adaptable Power Supply)
– Transmit power
– Module temperature
– Received power
– Transmit bias current monitor
Mechanical
• Mezzanine profile: 2.68" L x 1.42" W x 0.38" H (68.07 mm x 35.99 mm x 9.8 mm)
• Mezzanine module height for PCI card applications and mid-board mounting
• Separated signal/chassis ground (a common signal/chassis ground module version is
available upon request)
• Belly-to-belly applications
• De-latch mechanism with low extraction force (V23833-Gxxxx-Ax0x only)
• Built-in heat sink
Electrical
• Hot pluggable
• Power supply: +5.0 V, +3.3 V, Adaptable Power Supply (APS: +1.8 V)
• Total power consumption: 3.3 W typical
• XAUI electrical interface
– 3.125 Gbit/s Ethernet (V23833-G61xx-xxxx)
– 3.1875 Gbit/s Fibre Channel (V23833-G21xx-xxxx)
• Management and control via MDIO 2-wire bus
• 70-pin connector
Applications
• 10 Gbit/s Ethernet and Fibre Channel transmission systems for Long Range (LR)
• Integration on PCI card
• Mid-board mounting
• Belly-to-belly for high density applications
• Enterprise and campus network applications
• Storage applications
• Backplane and switch applications
• Core and edge routers
• Aggregation point for lower date rate
• XPAK evaluation kit V23833-G9909-Z001 available upon request
Preliminary Product Information
2
2004-05-13