C505CA-4RC Datasheet, PDF (20/22 Pages) Infineon Technologies AG – 8-bit Single-Chip Microcontroller (Bare Die Delivery)

C505CA-4RC
Step BB
Table 5
Wafer Characteristics
Item
Chips per wafer
Metallization layers
Metallization material
Metallization thickness
Metallization barrier material
Metallization isolation
Metallization material on pads
Passivation
Backside metallization
Inkdot diameter
Characteristic
820
2
AICu
Met1: 450 nm, Met2: 800 nm
Ti/Tin
FLOW-FILL
AICu (AI 99.5% - Cu 0.5%)
Si-Oxide (310 nm) + Si-Nitride (510 nm)
None (silicon)
1.0-1.3 mm (typical)
The wafers are glued to a plastic tape which is fixed within a plastic ring (see figure
below).
Wafers can be shipped in one piece or sawn into individual dies.
Data Sheet
20
V1.3, 2000-12