TLE4998P3C Datasheet, PDF (14/32 Pages) Infineon Technologies AG – Programmable Linear Hall Sensor

TLE4998P3C
Electrical, Thermal and Magnetic Parameters
Calculation of the Junction Temperature
The total power dissipation P_TOT of the chip increases its temperature above the ambient
temperature.
The power multiplied by the total thermal resistance R_thJA (Junction to Ambient) leads
to the final junction temperature. R_thJA is the sum of the addition of the values of the two
components Junction to Case and Case to Ambient.
R_thJA = R_thJC + R_thCA
T_J = T_A + ∆T
∆T = R_thJA x P_TOT = R_thJA x ( V_DD x I_DD + V_OUT x I_OUT )
I_DD , I_OUT > 0, if direction is into IC
Example (assuming no load on Vout):
– V_DD = 5 V
– I_DD = 8 mA
– ∆T = 190 [K/W] x (5 [V] x 0.008 [A] + 0 [VA] ) = 7.6 K
For moulded sensors, the calculation with R_thJC is more adequate.
Magnetic Parameters
Table 5
Magnetic Characteristics
Parameter
Symbol Limit Values
Unit Notes
min. typ. max.
Sensitivity
S¹⁾
± 0.2 -
±6
%/mT ²⁾
Sensitivity drift
∆S
-
± 80 ± 150 ppm/ ³⁾
°C
See Figure 4
Magnetic field range MFR ± 50 ± 100⁴⁾ ± 200 mT
Programmable ⁵⁾
Integral nonlinearity Inl
-
± 0.05 ± 0.1 %MFR ⁶⁾⁸⁾
Magnetic offset
B_OS
-
Magnetic offset drift ∆B_OS -
Magnetic hysteresis B_HYS -
-
± 400 µT
7)8)
±1
± 5 µT / °C Error band ⁸⁾
-
10
µT
9)
1) _{Defined as ∆DYPWM / ∆B}
2) _{Programmable in steps of 0.024%}
3) _{For any 1}st _{and 2}nd _{order polynomial, coefficient within definition in chapter 8. Valid for characterization at 0h}
4) _{This range is also used for temperature and offset pre-calibration of the IC}
Data Sheet
14
Rev 1.1, 2009-09