TLE5012BD Datasheet, PDF (13/17 Pages) Infineon Technologies AG – GMR-Based Dual Die Angle Sensor

6
Package Information
6.1
Package Parameters
Table 6-1 Package Parameters
Parameter
Symbol Limit Values
Unit
Thermal resistance¹⁾
Moisture Sensitivity Level
R_thJA
R_thJC
R_thJL
Min. Typ. Max.
120 140 K/W
35 K/W
70 K/W
MSL 3
Lead Frame
Cu
Plating
Sn 100%
1) R_th values only valid for both dies supplied with V_DD
2) according to Jedec JESD51-7
6.2
Package Outline
TLE5012BD
Package Information
Notes
Junction to air²⁾
Junction to case
Junction to lead
260°C
> 7 μm
Figure 6-1 PG-TDSO-16 package dimension
Data Sheet
13
Rev. 1.1, 2015-03-12