PTVA123501EFC_15 Datasheet, PDF (13/14 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs

PTVA123501EC
PTVA123501FC
Package Outline Specifications (cont.)
Package H-37248-2
45° X 2.720
[45° X .107]
CL
4.826±0.510
[.190±0.020]
D
FLANGE 9.779
[.385]
LID 9.398
+0.100
-0.150
[ ^.370
+0.004
-0.006
]
4X
R0.508
+.381
-.127
[
R.020
+0.015
-0.005
]
CL
19.431±0.510
[.765±0.020]
G
2X 12.700
[.500]
SPH 1.575
[.062]
19.812±0.200
[.780±0.008]
H-37248-2_po_10-04-2012
1.016
[.040]
3.632±0.380
[.143±0.015]
CL
S
20.574
[.810]

Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ± 0.127 [.005] unless specified otherwise.
4. Pins: D – drain; G – gate; S – source.
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch].
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http://www.infineon.com/rfpower
Data Sheet
13 of 14
Rev. 05, 2015-07-07