PTFB212503EFL Datasheet, PDF (13/14 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs 240 W, 2110 – 2170 MHz

PTFB212503EL
PTFB212503FL
Package Outline Specifications (cont.)
Package H-34288-4/2
45° X 2.032
[45° X .080]
2X 30°
V
22.860
[.900]
CL
D
2X 5.080
[.200]
2X 1.143
[.045]
V
4.889±.510
[.192±.020]
CL
4X
R0.508
+.381
-.127
[^{R.020+-.0.00155} ]
G
2X 12.700
[.500]
22.352±.200
[.880±.008]
9.398
[.370]
9.779
[.385]
19.558±.510
[.770±.020]
4.039
+.254
-.127
[^{.159+-.0.00150}]
1.575
[.062] (SPH)
1.016
[.040]
H-34288-4/2_po_03_08-13-2012
CL
23.114
[.910]
S

Diagram Notes—unless otherwise specified:
Diagra₁m_. N_Ino_ters_p—_reu_tn_dle_imss_eno_sth_ioe_nr_sw_ais_ne_ds_tp_oe_lec_ri_afi_ne_cd_e: _{s per ASME Y14.5M-1994.}
2¹.^. P^Inri^tm^era^pr^ry^ed^t i^dm^imen^esⁿi^soⁱn^os^nsar^aeⁿm^d m^to.^leA^ralteⁿr^cn^ea^ste^ped^rim^Ae^Sn^Ms^Eio^Yns¹⁴a^.r⁵e^Min^-1c⁹h⁹e⁴s.
3².^. A^Pll^rit^mol^ae^ra^yn^dc^imes^e±^ns0ⁱ.^o1ⁿ2^s7^a[0^re.0^m05^m] ^.u^An^lte^es^rs^nas^tp^ee^dc^imfie^edⁿo^sit^ohⁿe^srw^ai^rs^ee.^inches.
4³.^. P^Ain^lls^t:^oD^ler–^and^cra^ei^sn;^±G^0.–¹²g⁷at^[e^.0; S⁰⁵–^{] u}sⁿo^lu^er^sc^se;^sV^pe–^cV^ifi_D^e_D^{d otherwise.}
5⁴.^. L^Peⁱaⁿd^s:th^Dic⁼kn^de^rasⁱsⁿ:^;0^S.1⁼0^s+^o0^u.^r0^c5^e1^{; G}/–0⁼.0^g2^a5^tem^{; V}m⁼[0^V.0D0D4^. + 0.002/–0.001 inch].
6⁵.^. G^Lo^el^ad^dp^tl^haⁱt^cin^kg^neth^si^sc^:k⁰n^.e¹s⁰s⁺: 0⁰.2^.05⁵m^1/i^–c⁰ro^.0n²[⁵10^mm^mic^[.r⁰o⁰in⁴c⁺h]⁰m^.0a⁰x².^{/–0.001 inch].}
6. Gold plating thickness: 0.25 micron [10 microinch] max.
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Data Sheet
13 of 14
Rev. 07.1, 2016-06-15