PTFB212503EFL Datasheet, PDF (12/14 Pages) Infineon Technologies AG – Thermally-Enhanced High Power RF LDMOS FETs 240 W, 2110 – 2170 MHz

PTFB212503EL
PTFB212503FL
Package Outline Specifications
Package H-33288-6
4X R1.524
[R.060]
2X R1.626
[R.064]
45° X 2.032
[45° X .080]
4X 30°
V
4X 1.143
[.045] (4 PLS)
D
E
G
CL
2X 12.700
[.500]
2X 22.860
[.900]
27.940
[1.100]
22.352±.200
[.880±.008]
2X 5.080
[.200] (2 PLS)
4.889±.510
V
[.192±.020]
S
9.779
9.398 _[.385]
CL ^[.370]
19.558±.510
[.770±.020]
F
4.039 ^+-.1.22574
[^.159
] ^+.010
-.005
1.575
[.062] (SPH)
1.016
[.040]
CL
34.036
[1.340]
H-33288-6_po_01_10-03-2012
Diagram Notes—unless otherwise specified:
Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ±0.127 [0.005] unless specified otherwise.
3. All tolerances ± 0.127 [.005] unless specified otherwise.
4.
4.
5.
Pins:
Pins:
Lead
D – drain; G – gate; S – source; V –
G = gate, S = source, D = drain, V =
thickness: 0.10 + 0.051/–0.025 mm
[V^V0^D.^DD0^D;0,E4E, +^,FF0–.⁼0N0^N.2C./^C.–.0.001
inch].
5. Lead thickness: 0.10 + 0.051/–0.025 mm [.004 +0.002/–0.001 inch].
6. Gold plating thickness: 0.25 micron [10 microinch] max.
6. Gold plating thickness: 0.25 micron [10 microinch] max.
Data Sheet
12 of 14
Rev. 07.1, 2016-06-15