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TLE7237SL Datasheet, PDF (11/36 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control
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SPI Driver for Enhanced Relay Control
TLE7237SL
Electrical Characteristics
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Absolute Maximum Ratings1)
Pos. Parameter
Symbol Limit Values Unit Test Conditions
min. max.
4.1.11 Maximum energy dissipation one channel EAR
repetitive pulses for ch. 2,3
mJ 2)
1 · 104 cycles
1 · 106 cycles
Logic Pins
–
12
–
11
Tj(0) = 105 °C
ID(0) = 0.180 A
Tj(0) = 105 °C
ID(0) = 0.180 A
4.1.12 Voltage at input pins
4.1.13 Voltage at chip select pin
4.1.14 Voltage at serial clock pin
4.1.15 Voltage at serial input pin
4.1.16 Voltage at serial output pin
Temperatures
VIN
-0.3 VDD + 0.3 V
3)
VCS
-0.3 VDD + 0.3 V
3)
VSCLK
-0.3
VDD + 0.3 V
3)
VSI
-0.3 VDD + 0.3 V
3)
VSO
-0.3 VDD + 0.3 V
3)
4.1.17 Junction Temperature
4.1.18 Storage Temperature
ESD Susceptibility
Tj
-40
150
°C –
Tstg
-55
150
°C –
4.1.19 ESD susceptibility on all pins
VESD
-2
2
kV HBM4)
1) not subject to production test
2) Pulse shape represents inductive switch off: IL(t) = IL(0) * (1 - t / tpulse); 0 < t < tpulse
3) VDD + 0.3 V < 5.5 V
4) ESD susceptibility, HBM according to EIA/JESD 22-A114
4.2
Functional Range
Pos.
4.2.1
4.2.2
4.2.3
Parameter
Supply Voltage Range for
Nominal Operation
upper Supply Voltage Range for
Extended Operation
lower Supply Voltage Range for
Extended Operation
Symbol
Vbb(nom)
Limit Values
Min.
Max.
9
16
Vbb(ext),up 16
28
Vbb(ext),low 5.5
9
Unit Conditions
V
–
V
Parameter
Deviations possible
V
Parameter
Deviations possible
4.2.4 Junction Temperature
Tj
-40
150
°C –
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information, go to www.jedec.org.
Data Sheet
11
Rev. 1.0, 2010-02-18
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